CHINESE AMERICAN MEDICAL SOCIETY






SUMMER RESEARCH FELLOWSHIP PROGRAM:
 
  The Chinese American Medical Society (CAMS) offers scholarships for medical students working on summer research projects.  The research can be basic science or clinical in nature but must be completed in a ten week time frame.  Preferences will be given to proposals studying problems related to health problems of the Chinese.  Upon approval, CAMS will pay a student a stipend of up to $1000.00 per month.  At the conclusion of the project, a written report is expected.     
2010 PROGRAM:
  1. Purpose: To promote and support clinical and basic science research amongst Chinese American medical and dental students.

  2. Criteria: Projects lasting 6 to 8 weeks can either be in the basic sciences or clinical research.  A dentist or a physician must sponsor and supervise the project.  Special consideration will be given to projects involving Chinese American health issues. At the completion of the project, a written report should be submitted.  Applicant must be a current student in an accredited medical or dental school in the United States.

  3. Stipends: Students will be paid a stipend of $400 per week, for 8-10 weeks.  Research support and expenses are the responsibility of the sponsor.

  4. Application process: The applicant should submit the following:
    • CAMS Summer Research Fellowship Application.
    • Project description (include hypothesis, methodology).
    • Personal Statement.
    • Curriculum Vitae (include education, employment).
    • A letter from supervising investigator supporting the research project.
    • A letter from the Dean verifying good standing.

Please download a 2010 application form in PDF format.

Deadline of application: April 30, 2010.

Application and supporting materials must be sent by mail (e-mail not acceptable) to:

Jerry Huo, M.D., Chairman
CAMS Scholarship Committee

41 Elizabeth Street, Suite 403
New York, New York 10013
Tel: (212) 334-4760

Please address all inquiries to Dr. HuoDo not submit application or supporting materials by e-mail.



  Scholarship Program



[HOME] [BACK TO TOP]